Semiconductor device

ABSTRACT

A semiconductor device according to the invention of the present application includes a support, a semiconductor chip provided on the support and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein a plurality of cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor chip connected to the back surface, and the die bond material is provided integrally over the plurality of cutouts.

FIELD

The present invention relates to a semiconductor device and a semiconductor chip.

BACKGROUND

PTL 1 discloses a semiconductor device that includes a semiconductor chip, a die pad for supporting the semiconductor chip, and an adhesive for adhering the semiconductor chip to the die pad. By providing an irregular side surface in a side surface lower portion of the semiconductor chip, the adhesive creeps up more satisfactorily during die bond process, so that the adhesive properties with the die pad can be improved even for a small semiconductor chip.

CITATION LIST Patent Literature

-   [PTL 1] JP 2018-046289 A

SUMMARY Technical Problem

In general, in a semiconductor device for power amplification or the like, it is desirable that heat is efficiently discharged. Therefore, it is preferable that a die bond material for bonding a semiconductor chip to a heat sink or the like is spread over the entire back surface of the chip. This makes it possible to make the heat discharge area with respect to the heat sink as wide as possible. Whether the die bond material is spread over the entire back surface of the semiconductor chip can be determined based on the appearance such as a shape of a protruding portion of the die bond material protruding from the semiconductor chip, for example.

However, when an applied amount of the die bond material is too large, the die bond material may creep up to an upper surface of the semiconductor chip. In this case, the die bond material may reach an electrode formed on the upper surface of the semiconductor chip. This causes failure that the electrode is electrically conductive with the heat sink through the die bond material.

On the other hand, when an amount of the die bond material to be applied is reduced to reduce the creeping-up of the die bond material, the die bond material is less likely to protrude from the semiconductor chip. This may make it impossible to check from the appearance whether the die bond material is spread over the entire back surface of the semiconductor chip.

The present invention has been made to solve the above-described problems, and an object thereof is to provide a semiconductor device and a semiconductor chip which make it possible to easily check an area over which a die bond material is spread.

Solution to Problem

A semiconductor device according to the first invention of the present application includes a support, a semiconductor chip provided on the support and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein a plurality of cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor chip connected to the back surface, and the die bond material is provided integrally over the plurality of cutouts.

A semiconductor device according to the second invention of the present application includes a support, a semiconductor chip provided on the support and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein the semiconductor chip includes a transparent or semitransparent semiconductor substrate provided on the support, a plurality of recesses is formed in an outer peripheral portion of a back surface of the semiconductor substrate, the back surface facing to the support, and the die bond material is provided integrally over the plurality of recesses.

A semiconductor device according to the third invention of the present application includes a support, a semiconductor chip provided on the support and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein the semiconductor chip includes a semiconductor substrate provided on the support, a plurality of recesses is formed in an outer peripheral portion of the semiconductor substrate, each of the recesses passing through the semiconductor substrate from a back surface facing to the support to an upper surface opposite to the back surface, the semiconductor chip includes a plurality of conductors each of which is embedded in a corresponding one of the plurality of recesses from the upper surface side of the semiconductor substrate, and the die bond material is provided integrally over the plurality of recesses.

A semiconductor chip according to the fourth invention of the present application includes a semiconductor substrate, an electrode provided on an upper surface of the semiconductor substrate and a back surface conductor provided on a back surface of the semiconductor substrate, which is a surface opposite to the upper surface, wherein a plurality of first cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor substrate connected to the back surface, and a plurality of second cutouts is formed in the back surface conductor, each of the plurality of second cutouts being connected to a corresponding one of the plurality of first cutouts and passing through the back surface conductor from a first surface facing to the semiconductor substrate to a second surface opposite to the first surface.

Advantageous Effects of Invention

In the semiconductor device according to the first invention of the present application, the state of the die bond material can be checked from the plurality of cutouts formed in the semiconductor chip. Accordingly, this makes it possible to easily check the area over which the die bond material is spread.

In the semiconductor device according to the second invention of the present application, the die bond material which has entered the plurality of recesses can be checked through the transparent or semitransparent semiconductor substrate. Accordingly, this makes it possible to easily check the area over which the die bond material is spread.

In the semiconductor device according to the third invention of the present application, the state of the die bond material can be checked depending on whether the die bond material is conductive with the plurality of conductors. Accordingly, this makes it possible to easily check the area over which the die bond material is spread.

In the semiconductor device according to the fourth invention of the present application, the state of the die bond material can be checked from the plurality of first cutouts and the plurality of second cutouts. Accordingly, this makes it possible to easily check the area over which the die bond material is spread.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a semiconductor chip according to the first embodiment.

FIG. 2A is a plan view of the semiconductor chip according to the first embodiment.

FIG. 2B is a left side view of the semiconductor chip according to the first embodiment.

FIG. 2C is a front view of the semiconductor chip according to the first embodiment.

FIG. 2D is a right side view of the semiconductor chip according to the first embodiment.

FIG. 2E is a bottom view of the semiconductor chip according to the first embodiment.

FIG. 3 is a diagram illustrating a method of manufacturing the semiconductor chip according to the first embodiment.

FIG. 4 is a perspective view of a semiconductor chip according to a comparative example.

FIG. 5A is a plan view of the semiconductor chip according to the comparative example.

FIG. 5B is a left side view of the semiconductor chip according to the comparative example.

FIG. 5C is a front view of the semiconductor chip according to the comparative example.

FIG. 5D is a right side view of the semiconductor chip according to the comparative example.

FIG. 5E is a bottom view of the semiconductor chip according to the comparative example.

FIG. 6A is a plan view of a semiconductor device according to the comparative example.

FIG. 6B is a front view of the semiconductor device according to the comparative example.

FIG. 7A is a plan view of a semiconductor device according to another comparative example.

FIG. 7B is a front view of the semiconductor device according to another comparative example.

FIG. 8 is a front view of a semiconductor device according to the first embodiment.

FIG. 9 is an enlarged view of the cutout according to the first embodiment.

FIG. 10 is an enlarged view of the cutout according to the first embodiment.

FIG. 11 is an enlarged view of the cutout according to the first embodiment.

FIG. 12A is a plan view of a semiconductor chip according to the second embodiment.

FIG. 12B is a left side view of the semiconductor chip according to the second embodiment.

FIG. 12C is a front view of the semiconductor chip according to the second embodiment.

FIG. 12D is a right side view of the semiconductor chip according to the second embodiment.

FIG. 12E is a bottom view of the semiconductor chip according to the second embodiment.

FIG. 13 is a plan view of a semiconductor device according to the second embodiment.

FIG. 14 is an enlarged view of the cutout according to the second embodiment.

FIG. 15 is an enlarged view of the cutout according to the second embodiment.

FIG. 16 is an enlarged view of the cutout according to the second embodiment.

FIG. 17A is a plan view of a semiconductor chip according to the third embodiment.

FIG. 17B is a left side view of the semiconductor chip according to the third embodiment.

FIG. 17C is a front view of the semiconductor chip according to the third embodiment.

FIG. 17D is a right side view of the semiconductor chip according to the third embodiment.

FIG. 17E is a bottom view of the semiconductor chip according to the third embodiment.

FIG. 18 is a plan view of a semiconductor device according to the third embodiment.

FIG. 19 is an enlarged view of the cutout according to the third embodiment.

FIG. 20 is an enlarged view of the cutout according to the third embodiment.

FIG. 21A is a plan view of a semiconductor chip according to the fourth embodiment.

FIG. 21B is a left side view of the semiconductor chip according to the fourth embodiment.

FIG. 21C is a front view of the semiconductor chip according to the fourth embodiment.

FIG. 21D is a right side view of the semiconductor chip according to the fourth embodiment.

FIG. 21E is a bottom view of the semiconductor chip according to the fourth embodiment.

FIG. 22 is a cross-sectional view of a semiconductor device according to the fourth embodiment.

FIG. 23 is a front view of the semiconductor device according to the fourth embodiment.

FIG. 24 is an enlarged view of the recess according to the fourth embodiment.

FIG. 25 is an enlarged view of the recess according to the fourth embodiment.

FIG. 26 is an enlarged view of the recess according to the fourth embodiment.

FIG. 27A is a plan view of a semiconductor chip according to the fifth embodiment.

FIG. 27B is a bottom view of the semiconductor chip according to the fifth embodiment.

FIG. 28 is a cross-sectional view of the semiconductor chip according to the fifth embodiment.

FIG. 29 is a cross-sectional view of a semiconductor device according to the fifth embodiment.

FIG. 30 is an enlarged view of the recess according to the fifth embodiment.

FIG. 31 is an enlarged view of the recess according to the fifth embodiment.

FIG. 32 is an enlarged view of the recess according to the fifth embodiment.

DESCRIPTION OF EMBODIMENTS

Semiconductor devices and semiconductor chips according to embodiments of the present invention are described with reference to drawings. Identical or corresponding constitutional elements are given the same reference numerals, and the repeated description of such constitutional elements may be omitted.

First Embodiment

FIG. 1 is a perspective view of a semiconductor chip 1 according to the first embodiment. FIG. 2A is a plan view of the semiconductor chip 1 according to the first embodiment. FIG. 2B is a left side view of the semiconductor chip 1 according to the first embodiment. FIG. 2C is a front view of the semiconductor chip 1 according to the first embodiment. FIG. 2D is a right side view of the semiconductor chip 1 according to the first embodiment. FIG. 2E is a bottom view of the semiconductor chip 1 according to the first embodiment.

The semiconductor chip 1 includes a semiconductor substrate 10. A semiconductor layer is formed on an upper surface side of the semiconductor substrate 10. The semiconductor layer forms an active element such as a power amplifying semiconductor device. A circuit element may be formed on the upper surface side of the semiconductor substrate 10. An electrode 20 is provided on the upper surface of the semiconductor substrate 10. The electrode 20 serves as an electrode of the active element or the circuit element.

For example, a field effect transistor is formed in the semiconductor chip 1. The semiconductor substrate 10 may be made with SiC. The active element formed in the semiconductor substrate 10 may be a high electron mobility transistor (HEMT) formed from GaN, for example. In this case, the electrode 20 includes a source electrode 21, a gate electrode 22, and a drain electrode 23.

A back surface conductor 30 is provided on the back surface which is a surface opposite to the upper surface of the semiconductor substrate 10. The back surface conductor 30 covers substantially the entire back surface of the semiconductor substrate 10. The back surface conductor 30 is provided in a center portion of the back surface of the semiconductor substrate 10. An outer peripheral portion of the back surface of the semiconductor substrate 10 is exposed from the back surface conductor 30. The entirety of the back surface of the semiconductor substrate 10 may be covered by the back surface conductor 30.

The back surface conductor 30 may be insulated from the electrode 20. Furthermore, the back surface conductor 30 may be electrically connected to the source electrode 21 through a via hole (not illustrated) formed in the semiconductor substrate 10.

A plurality of cutouts 12 a to 12 h is formed at edges formed between the back surface and side surfaces of the semiconductor chip 1 connected to the back surface. Each of the plurality of cutouts 12 a to 12 h is formed by cutting out a portion on the back surface side in the side surface of the semiconductor chip 1. The cutouts 12 a to 12 c and the cutouts 12 e to 12 g are formed in the two side surfaces extending in the longitudinal direction in the semiconductor chip 1, respectively. The cutouts 12 d and 12 h are formed in the two side surfaces extending in a short-side direction in the semiconductor chip 1, respectively.

Each of the cutouts 12 a to 12 h is formed to extend from the semiconductor substrate 10 to the back surface conductor 30. A plurality of first cutouts is formed at edges formed between the back surface of the semiconductor substrate 10, which is a surface facing to the back surface conductor 30, and the side surfaces connected to the back surface. Furthermore, a plurality of second cutouts is formed in the back surface conductor 30. Each of the plurality of second cutouts passes through the back surface conductor 30 from a first surface facing to the semiconductor substrate 10 to a second surface opposite to the first surface. Each of the plurality of second cutouts is connected to the corresponding one of the plurality of first cutouts.

FIG. 3 is a diagram illustrating a method of manufacturing the semiconductor chip 1 according to the first embodiment. FIG. 3 illustrates a method of forming the plurality of cutouts 12 a to 12 h. A plurality of dug holes 112 a to 112 h is formed in a wafer state after the semiconductor layer, the electrode 20, and the back surface conductor 30 are formed on the semiconductor substrate 10. Each of the plurality of dug holes 112 a to 112 h is arranged to extend between a dicing street 80 for separating chips from each other and a region serving as the semiconductor chip 1.

Next, the dicing is performed along the dicing streets 80. Accordingly, the semiconductor chip 1 is separated from the wafer state. As a result, the dug holes 112 a to 112 h make the cutouts 12 a to 12 h, respectively.

FIG. 4 is a perspective view of a semiconductor chip 1 a according to a comparative example. FIG. 5A is a plan view of the semiconductor chip 1 a according to the comparative example. FIG. 5B is a left side view of the semiconductor chip 1 a according to the comparative example. FIG. 5C is a front view of the semiconductor chip 1 a according to the comparative example. FIG. 5D is a right side view of the semiconductor chip 1 a according to the comparative example. FIG. 5E is a bottom view of the semiconductor chip 1 a according to the comparative example. The semiconductor chip 1 a according to the comparative example is different from the semiconductor chip 1 in that the cutouts 12 a to 12 h are not provided.

FIG. 6A is a plan view of a semiconductor device 2 a according to the comparative example. FIG. 6B is a front view of the semiconductor device 2 a according to the comparative example. In the semiconductor device 2 a, the semiconductor chip 1 a is bonded to an upper surface of a support 50 by a die bond material 40.

In the semiconductor device 2 a, the die bond material 40 is provided on the entire back surface of the semiconductor chip 1 a to efficiently radiate heat. In the semiconductor device 2 a, an appearance inspection is performed to determine whether the die bond material 40 is spread over the entire back surface of the semiconductor chip 1 a. Whether the die bond material 40 is properly spread is determined based on the size, shape, etc. of the portion of the die bond material 40 protruding from the semiconductor chip 1 a, when the semiconductor chip 1 a is viewed from the upper surface side, for example.

In the semiconductor device 2 a, it is conceivable that a large amount of die bond material 40 is required when the die bond material 40 is applied to protrude from the entire outer peripheral portion of the semiconductor chip 1 a, for example. In this case, the die bond material 40 may creep up to the upper surface of the semiconductor chip 1 a, as indicated by a portion surrounded by a dotted line 41. Accordingly, the electrode 20 and the support 50 may be electrically conductive with each other through the die bond material 40.

FIG. 7A is a plan view of a semiconductor device 2 b according to another comparative example. FIG. 7B is a front view of the semiconductor device 2 b according to another comparative example. In the semiconductor device 2 b, an amount of the die bond material 40 is smaller than the amount of die bond material 40 in the semiconductor device 2 a. This can prevent the die bond material 40 from creeping up. However, when the amount of die bond material 40 is reduced, a portion where the die bond material 40 does not protrude from the semiconductor chip 1 a is easily formed in the outer peripheral portion of the semiconductor chip 1 a. This makes it impossible to check from the appearance whether the die bond material 40 is spread over the entire back surface of the semiconductor chip 1 a.

FIG. 8 is a front view of a semiconductor device 2 according to the first embodiment. The semiconductor device 2 includes a support 50, a semiconductor chip 1 provided on the support 50, and a die bond material 40 for bonding a back surface of the semiconductor chip 1 to the support 50. The support 50 is, for example, a heat sink. The support 50 may be a substrate or a package.

The semiconductor chip 1 is die-bonded to the support 50 by the die bond material 40. The die bond material 40 is, for example, a conductive die bond material. The die bond material 40 is filled into a space between the upper surface of the support 50 and the back surface of the semiconductor chip 1, and fixes the semiconductor chip 1 to the support 50. The die bond material 40 can be used to efficiently discharge or radiate, to the support 50, the heat generated from the active element or the circuit element formed in the semiconductor chip 1.

FIG. 9 is an enlarged view of the cutout 12 a according to the first embodiment. FIG. 10 is an enlarged view of the cutout 12 b according to the first embodiment. FIG. 11 is an enlarged view of the cutout 12 c according to the first embodiment. FIGS. 9 to 11 each illustrate a state in which the corresponding one of the cutouts 12 a to 12 c and the die bond material 40 are viewed from the side surface side of the semiconductor chip 1. As for each of the cutouts 12 a to 12 h, it can be checked whether the die bond material 40 is spread to the cutout. That is, in each of the cutouts 12 a to 12 h, an applied amount of the die bond material 40 can be checked.

Next, a method of inspecting the semiconductor device 2 in the present embodiment will be described. Firstly, the back surface of the semiconductor chip 1 and the support 50 are bonded by the die bond material 40. Next, as for each of the cutouts 12 a to 12 h, it is visually checked whether the die bond material 40 is spread to the cutout.

As illustrated in FIGS. 9 and 10, the die bond material 40 can be visually observed from the cutouts 12 a and 12 b. Accordingly, in the back surface of the semiconductor chip 1, it can be checked that the die bond material 40 is spread to the cutouts 12 a and 12 b.

On the other hand, as illustrated in FIG. 11, the die bond material 40 cannot be visually observed from the cutout 12 c. Accordingly, in the back surface of the semiconductor chip 1, it can be checked that the die bond material 40 is not spread to the cutout 12 c. That is, it can be visually checked that the die bond material 40 is not spread to the target area. The target area is an area in the back surface of the semiconductor chip 1, in which the die bond material 40 needs to be provided.

FIGS. 8 to 11 each illustrate an example in which the die bond material 40 is not exposed from the cutout 12 c for the purpose of the description. In actual, in the semiconductor device 2 which is a good product, the die bond material 40 is exposed from all of the plurality of cutouts 12 a to 12 h. That is, the die bond material 40 is provided integrally over the plurality of cutouts 12 a to 12 h.

The size of each of the cutouts 12 a to 12 h is to be set such that it can be checked from the appearance whether the die bond material 40 reaches the cutout. The size of each of the cutouts 12 a to 12 h is set according to the magnification of a magnifier used for the appearance inspection, for example.

In the present embodiment, an example in which the appearance inspection is performed visually is described. Without being limited thereto, the appearance inspection may be performed using an imaging device such as a camera.

In the present embodiment, it can be checked from the appearance on the side surface side of the semiconductor chip 1 whether the die bond material 40 is spread over the entire back surface of the semiconductor chip 1 or to the target area in the back surface of the semiconductor chip 1.

In the present embodiment, the appearance inspection can be performed even when the die bond material 40 does not protrude from the semiconductor chip 1. This can reduce the amount of the die bond material 40 to be applied. Thus, the die bond material 40 can be prevented from creeping up to the upper surface of the semiconductor substrate 10. Accordingly, the electrode 20 can be prevented from being electrically conductive with the support 50 through the die bond material 40.

Note that in the example in FIG. 9, the die bond material 40 overflows the cutout 12 a. However, the die bond material 40 does not reach the electrode 20 provided on the upper surface of the semiconductor substrate 10, and therefore no problem exists.

As described above, in the semiconductor device 2 and the semiconductor chip 1 of the present embodiment, the cutouts 12 a to 12 h help to easily check the area over which the die bond material 40 is spread. Thus, it can be surely checked whether the die bond material 40 is spread over the target area. In the power amplifying semiconductor chip 1 having large heat generation, it is particularly important to ensure the heat discharge area. The electrode 20 can be prevented from contacting the die bond material 40, thereby improving the reliability of the semiconductor device 2. The consumption amount of the die bond material 40 can be reduced, and the manufacturing cost of the semiconductor device 2 can be reduced.

At least one of the plurality of cutouts 12 a to 12 h is formed in each side of the back surface of the semiconductor chip 1. That is, at least one of the plurality of first cutouts is formed in each side of the back surface of the semiconductor substrate 10. Thus, it can be surely checked that the die bond material 40 is spread to each side of the back surface of the semiconductor chip 1.

In the present embodiment, the die bond material 40 covers the entirety of the back surface of the semiconductor chip 1. As a modified example, a portion of the back surface of the semiconductor chip 1 may be exposed from the die bond material 40. That is, the die bond material 40 need not be provided over the entire back surface of the semiconductor chip 1 depending on the heat radiation performance to be required. If the heat can be sufficiently radiated, the back surface conductor 30 need not be provided.

In the present embodiment, the eight cutouts 12 a to 12 h are formed in the semiconductor chip 1. The number of the plurality of cutouts 12 a to 12 h may be any number of two or more. The arrangement and the number of the plurality of cutouts 12 a to 12 h may be changed according to the shape of the semiconductor chip 1 or the area in which the die bond material 40 is provided. Furthermore, each of the plurality of cutouts 12 a to 12 h is formed into a semiellipse shape when viewed from a direction perpendicular to the side surface or back surface of the semiconductor substrate 10. Without being limited thereto, the plurality of cutouts 12 a to 12 h may be of any shape such that the state of the die bond material 40 can be checked from the appearance.

These modifications can be applied, as appropriate, to a semiconductor device and a semiconductor chip according to the following embodiments. Note that the semiconductor devices and the semiconductor chips according to the following embodiments are similar to those of the first embodiment in many respects, and thus differences between the semiconductor devices and the semiconductor chips according to the following embodiments and those of the first embodiment will be mainly described below.

Second Embodiment

FIG. 12A is a plan view of a semiconductor chip 201 according to the second embodiment. FIG. 12B is a left side view of the semiconductor chip 201 according to the second embodiment. FIG. 12C is a front view of the semiconductor chip 201 according to the second embodiment. FIG. 12D is a right side view of the semiconductor chip 201 according to the second embodiment. FIG. 12E is a bottom view of the semiconductor chip 201 according to the second embodiment.

The semiconductor chip 201 of the present embodiment is different from the semiconductor chip of the first embodiment in that cutouts 212 a to 212 h are formed instead of the cutouts 12 a to 12 h. The other structure is similar to that of the first embodiment. Each of the cutouts 212 a to 212 h passes through the semiconductor chip 201 from a back surface thereof to an upper surface thereof opposite to the back surface.

A method of forming the cutouts 212 a to 212 h is similar to the method of forming the cutouts 12 a to 12 h of the first embodiment. In a wafer state, each of a plurality of through holes is formed to extend between a dicing street and a region serving as the semiconductor chip 201. Next, the plurality of through holes makes the cutouts 212 a to 212 h by performing the dicing along the dicing streets.

FIG. 13 is a plan view of a semiconductor device 202 according to the second embodiment. In the semiconductor device 202, the semiconductor chip 201 is bonded to a support 50 by a die bond material 40.

FIG. 14 is an enlarged view of the cutout 212 a according to the second embodiment. FIG. 15 is an enlarged view of the cutout 212 b according to the second embodiment. FIG. 16 is an enlarged view of the cutout 212 c according to the second embodiment. FIGS. 14 to 16 each illustrate a state in which the corresponding one of the cutouts 212 a to 212 c and the die bond material 40 are viewed from the upper surface side of the semiconductor chip 201. As for each of the cutouts 212 a to 212 h, it can be checked whether the die bond material 40 is spread to the cutout.

As illustrated in FIGS. 14 and 15, the die bond material 40 can be visually observed from the cutouts 212 a and 212 b. Accordingly, in the back surface of the semiconductor chip 201, it can be checked that the die bond material 40 is spread to the cutouts 212 a and 212 b. On the other hand, as illustrated in FIG. 16, the die bond material 40 cannot be visually observed from the cutout 212 c. Accordingly, in the back surface of the semiconductor chip 201, it can be checked that the die bond material 40 is not spread to the cutout 212 c.

Note that FIGS. 13 to 16 each illustrate an example in which the die bond material 40 is not exposed from the cutout 212 c for the purpose of the description. In actual, in the semiconductor device 202 which is a good product, the die bond material 40 is exposed from all of the plurality of cutouts 212 a to 212 h.

Also in the present embodiment, the cutouts 212 a to 212 h help to easily check the area over which the die bond material 40 is spread. Also in the present embodiment, the appearance inspection can be performed even when the die bond material 40 does not protrude from the semiconductor chip 201. This can reduce the amount of the die bond material 40 to be applied, and the die bond material 40 can be prevented from creeping up to the upper surface of the semiconductor substrate 10. Accordingly, the reliability of the semiconductor device 202 can be improved. Furthermore, the consumption amount of the die bond material 40 can be reduced, and the manufacturing cost of the semiconductor device 202 can be reduced.

Note that in the example in FIG. 15, the die bond material 40 overflows the cutout 212 b. Also in this case, it is only required that the die bond material 40 does not reach the electrode 20 provided on the upper surface of the semiconductor substrate 10. It can be visually checked from the side surface side of the semiconductor chip 201 that the die bond material 40 does not reach the upper surface of the semiconductor substrate 10.

In the present embodiment, the appearance inspection is performed from the upper surface of the semiconductor chip 201. Without being limited thereto, the area over which the die bond material 40 is spread may be determined by performing the appearance inspection from the side surface side of the semiconductor chip 201.

Each of the plurality of cutouts 212 a to 212 h is formed into a semiellipse shape when viewed from a direction perpendicular to the upper surface of the semiconductor substrate 10. Without being limited thereto, the plurality of cutouts 212 a to 212 h may be of any shape such that the state of the die bond material 40 can be checked from the appearance.

Third Embodiment

FIG. 17A is a plan view of a semiconductor chip 301 according to the third embodiment. FIG. 17B is a left side view of the semiconductor chip 301 according to the third embodiment. FIG. 17C is a front view of the semiconductor chip 301 according to the third embodiment. FIG. 17D is a right side view of the semiconductor chip 301 according to the third embodiment. FIG. 17E is a bottom view of the semiconductor chip 301 according to the third embodiment.

The semiconductor chip 301 of the present embodiment is different from the semiconductor chip of the first embodiment in that cutouts 312 a to 312 d are formed instead of the cutouts 12 a to 12 h. The other structure is similar to that of the first embodiment. Each of the cutouts 312 a to 312 d passes through the semiconductor chip 201 from a back surface thereof to an upper surface thereof opposite to the back surface. Each of the plurality of cutouts 312 a to 312 d is formed at the corresponding one of all the edges of the back surface of the semiconductor chip 301. That is, the plurality of cutouts 312 a to 312 d is formed at four corners of the semiconductor chip 301.

A method of forming the cutouts 312 a to 312 d is similar to the method of forming the cutouts 12 a to 12 h of the first embodiment. In a wafer state, each of a plurality of through holes is formed to extend between a dicing street and a region serving as the semiconductor chip 301. Next, the plurality of through holes makes the cutouts 312 a to 312 d by performing the dicing along the dicing streets.

FIG. 18 is a plan view of a semiconductor device 302 according to the third embodiment. In the semiconductor device 302, the semiconductor chip 301 is bonded to a support 50 by a die bond material 40.

FIG. 19 is an enlarged view of the cutout 312 a according to the third embodiment. FIG. 20 is an enlarged view of the cutout 312 b according to the third embodiment. FIGS. 19 and 20 each illustrate a state in which the corresponding one of the cutouts 312 a and 312 b and the die bond material 40 are viewed from the upper surface side of the semiconductor chip 301. As for each of the cutouts 312 a to 312 d, it can be checked whether the die bond material 40 is spread to the cutout.

As illustrated in FIG. 19, the die bond material 40 can be visually observed from the cutout 312 a. Accordingly, in the back surface of the semiconductor chip 301, it can be checked that the die bond material 40 is spread to the cutout 312 a. On the other hand, as illustrated in FIG. 20, the die bond material 40 cannot be visually observed from the cutout 312 b. Accordingly, in the back surface of the semiconductor chip 301, it can be checked that the die bond material 40 is not spread to the cutout 312 b.

Note that FIGS. 18 to 20 each illustrate an example in which the die bond material 40 is not exposed from the cutout 312 b for the purpose of the description. In actual, in the semiconductor device 302 which is a good product, the die bond material 40 is exposed from all of the plurality of cutouts 312 a to 312 d.

Also in the present embodiment, the cutouts 312 a to 312 d help to easily check the area over which the die bond material 40 is spread. Also in the present embodiment, the appearance inspection can be performed even when the die bond material 40 does not protrude from the semiconductor chip 301. This can reduce the amount of the die bond material 40 to be applied, and the die bond material 40 can be prevented from creeping up to the upper surface of the semiconductor substrate 10. Accordingly, the reliability of the semiconductor device 302 can be improved. Furthermore, the consumption amount of the die bond material 40 can be reduced, and the manufacturing cost of the semiconductor device 302 can be reduced.

Note that in the example in FIG. 19, the die bond material 40 overflows the cutout 312 a. Also in this case, it is only required that the die bond material 40 does not reach the electrode 20 provided on the upper surface of the semiconductor substrate 10. It can be visually checked from the side surface side of the semiconductor chip 301 that the die bond material 40 does not reach the upper surface of the semiconductor substrate 10.

Each of the plurality of cutouts 312 a to 312 d is formed into a fan shape when viewed from a direction perpendicular to the upper surface of the semiconductor substrate 10. Without being limited thereto, the plurality of cutouts 312 a to 312 d may be of any shape such that the state of the die bond material 40 can be checked from the appearance.

Fourth Embodiment

FIG. 21A is a plan view of a semiconductor chip 401 according to the fourth embodiment. FIG. 21B is a left side view of the semiconductor chip 401 according to the fourth embodiment. FIG. 21C is a front view of the semiconductor chip 401 according to the fourth embodiment. FIG. 21D is a right side view of the semiconductor chip 401 according to the fourth embodiment. FIG. 21E is a bottom view of the semiconductor chip 401 according to the fourth embodiment.

The semiconductor chip 401 of the present embodiment includes a transparent or semitransparent semiconductor substrate 410 instead of the semiconductor substrate 10. The semiconductor substrate 410 may be, for example, an SiC substrate. Instead of the plurality of cutouts 12 a to 12 h, a plurality of recesses 412 a to 412 f is formed in an outer peripheral portion of the semiconductor substrate 410. Each of the plurality of recesses 412 a to 412 f passes through the semiconductor chip 401 from a back surface thereof to an upper surface thereof. The recesses 412 a to 412 f are formed outside the electrode 20. The other structure is similar to that of the first embodiment.

FIG. 22 is a cross-sectional view of a semiconductor device 402 according to the fourth embodiment. In the semiconductor device 402, the semiconductor chip 401 is bonded to a support 50 by a die bond material 40. The semiconductor substrate 410 is provided on the support 50. A back surface conductor 30 and the die bond material 40 are provided between the semiconductor substrate 410 and the support 50. A semiconductor layer 414 is provided on an upper surface side of the semiconductor substrate 410. Furthermore, a via hole 416 is formed in the semiconductor substrate 410. The via hole 416 passes through the semiconductor substrate 410 from the upper surface to the back surface.

A side surface of the semiconductor substrate 410 forming the via hole 416 is covered by plating wiring. The plating wiring and the back surface conductor 30 are connected to each other. Furthermore, on the semiconductor substrate 410, the plating wiring contacts a source electrode 21. This causes the source electrode 21 to be electrically connected to the support 50 through a plating electrode, the back surface conductor 30, and the die bond material 40. Accordingly, the source electrode 21, the plating electrode, the back surface conductor 30, the die bond material 40 and the support 50 are set to the same potential.

A recess 412 illustrated in FIG. 22 is any one of the recesses 412 a to 412 f. The plating electrode is not provided in the side surface of the semiconductor substrate 410 forming the recess 412. Accordingly, it can be visually checked through the transparent or semitransparent semiconductor substrate 410 whether the die bond material enters the recess 412.

FIG. 23 is a front view of the semiconductor device 402 according to the fourth embodiment. FIG. 24 is an enlarged view of the recess 412 a according to the fourth embodiment. FIG. 25 is an enlarged view of the recess 412 b according to the fourth embodiment. FIG. 26 is an enlarged view of the recess 412 c according to the fourth embodiment. FIGS. 24 to 26 each illustrate a state in which the corresponding one of the recesses 412 a to 412 c and the die bond material 40 are viewed through the semiconductor substrate 410. FIGS. 24 to 26 each illustrate a state in which the semiconductor chip 401 is viewed from a direction perpendicular to the side surface, for example. As for each of the recesses 412 a to 412 f, it can be checked whether the die bond material 40 enters the recess.

As illustrated in FIGS. 24 and 25, the die bond material 40 which has entered the recesses 412 a and 412 b can be visible through the semiconductor substrate 410. Accordingly, in the back surface of the semiconductor chip 401, it can be checked that the die bond material 40 is spread to the recesses 412 a and 412 b. On the other hand, as illustrated in FIG. 26, the die bond material 40 cannot be visually observed in the recess 412 c. Accordingly, in the back surface of the semiconductor chip 401, it can be checked that the die bond material 40 is not spread to the recess 412 c.

Note that FIGS. 23 to 26 each illustrate an example in which the die bond material 40 does not enter the recess 412 c for the purpose of the description. In actual, in the semiconductor device 402 which is a good product, the die bond material 40 enters each of the plurality of recesses 412 a to 412 f. The die bond material 40 is provided integrally over the plurality of recesses 412 a to 412 f.

In the present embodiment, the transparent or semitransparent semiconductor substrate 410 and the recesses 412 a to 412 f help to easily check the area over which the die bond material 40 is spread. Also, the appearance inspection can be performed even when the die bond material 40 does not protrude from the semiconductor chip 401. This can reduce the amount of the die bond material 40 to be applied, and the die bond material 40 can be prevented from creeping up to the upper surface of the semiconductor substrate 410. Accordingly, the reliability of the semiconductor device 402 can be improved. Furthermore, the consumption amount of the die bond material 40 can be reduced, and the manufacturing cost of the semiconductor device 402 can be reduced.

In the present embodiment, the recesses 412 a to 412 c extend along one long side of the semiconductor substrate 410. The recesses 412 d to 412 f extend along the other long side of the semiconductor substrate 410. The recesses 412 a and 412 d extend along one short side of the semiconductor substrate 410. The recesses 412 c and 412 f extend along the other short side of the semiconductor substrate 410. Thus, at least one of the plurality of recesses 412 a to 412 f is formed along each side of the back surface of the semiconductor substrate 410. In this way, it can be checked that the die bond material 40 is spread to each side of the back surface of the semiconductor chip 401.

Furthermore, each of the plurality of recesses 412 a, 412 c, 412 d, and 412 f is formed at the corresponding one of all the edges of the back surface of the semiconductor substrate 410 facing to the support 50. In this way, it can be checked that the die bond material 40 is spread to four corners of the back surface of the semiconductor chip 401.

The arrangement, the number and the shape of the plurality of recesses 412 a to 412 f may be changed according to the shape of the semiconductor chip 401 or the area in which the die bond material 40 is provided.

As a modified example of the present embodiment, the plurality of recesses 412 a to 412 f need not pass through the semiconductor substrate 410. It is only required that the plurality of recesses 412 a to 412 f is formed in the outer peripheral portion of the back surface of the semiconductor substrate 410.

It is only required that the semiconductor substrate 410 is formed from a material which makes it possible to check through the semiconductor substrate 410 whether the die bond material 40 enters the recesses 412 a to 412 f.

Fifth Embodiment

FIG. 27A is a plan view of a semiconductor chip 501 according to the fifth embodiment. FIG. 27B is a bottom view of the semiconductor chip 501 according to the fifth embodiment. FIG. 28 is a cross-sectional view of the semiconductor chip 501 according to the fifth embodiment. FIG. 28 is the cross-sectional view taken along a straight line A-B of FIG. 27A.

Similarly to the fourth embodiment, a plurality of recesses 412 a to 412 f is formed in an outer peripheral portion of the semiconductor substrate 410, each of the recesses passing through the semiconductor substrate 410 from a back surface thereof to an upper surface thereof opposite to the back surface.

The semiconductor chip 501 includes a plurality of conductors 560 a to 560 f which is embedded in the plurality of recesses 412 a to 412 f from the upper surface side of the semiconductor substrate 410, respectively. Each lower end of the plurality of conductors 560 a to 560 f is provided between the upper surface and back surface of the semiconductor substrate 410. Each lower end of the plurality of conductors 560 a to 560 f is separated from the back surface of the semiconductor substrate 410. Each of the plurality of conductors 560 a to 560 f is separated from an electrode 20 of the semiconductor chip 501.

The conductor 560 a includes a main portion 561 a provided in the recess 412 a and a wide portion 562 a provided on the upper surface of the semiconductor substrate 410. The wide portion 562 a is wider than the recess 412 a. The same applies to the conductors 560 b to 560 f.

FIG. 29 is a cross-sectional view of a semiconductor device 502 according to the fifth embodiment. In the semiconductor device 502, the semiconductor chip 501 is bonded to a support 50 by a die bond material 40.

FIG. 30 is an enlarged view of the recess 412 a according to the fifth embodiment. FIG. 31 is an enlarged view of the recess 412 b according to the fifth embodiment. FIG. 32 is an enlarged view of the recess 412 c according to the fifth embodiment. Also in the present embodiment, similarly to the fourth embodiment, it can be visually checked from the side surface side of the semiconductor chip 501 whether the die bond material 40 enters the recesses 412 a to 412 f. Accordingly, the same effect as the fourth embodiment can be obtained.

As illustrated in FIGS. 30 and 31, each of the conductors 560 a and 560 b contact the die bond material 40. Accordingly, the conductors 560 a and 560 b are electrically conductive with the support 50. On the other hand, as illustrated in FIG. 32, the conductor 560 c does not contact the die bond material 40. Accordingly, the conductor 560 c is not electrically conductive with the support 50.

Therefore, in the present embodiment, whether the die bond material 40 is spread to the target area in the back surface of the semiconductor chip 501 can be checked depending on whether the conductors 560 a to 560 f are electrically conductive with the support 50.

Note that FIGS. 29 to 32 each illustrate an example in which the die bond material 40 does not contact the conductor 560 c for the purpose of the description. In actual, in the semiconductor device 502 which is a good product, the die bond material 40 contacts each of the plurality of conductors 560 a to 560 f. The die bond material 40 is provided integrally over the plurality of recesses 412 a to 412 f.

In the present embodiment, an application state of the die bond material 40 can be checked by a continuity inspection. Accordingly, a visual check process can be eliminated. When the visual check process is eliminated, the semiconductor substrate 410 need not be transparent or semitransparent. The area over which the die bond material 40 is spread may be checked by combining the continuity inspection and the appearance inspection.

Additionally, the continuity inspection can be easily performed by using the wide portion 562 a as an electrode for the continuity inspection.

Note that the technical features described in the above embodiments may be combined as appropriate.

REFERENCE SIGNS LIST

-   1, 1 a semiconductor chip, 2, 2 a, 2 b semiconductor device, 10     semiconductor substrate, 12 a-12 h cutout, 20 electrode, 21 source     electrode, 22 gate electrode, 23 drain electrode, 30 back surface     conductor, 40 die bond material, 50 support, 80 dicing street, 112     a-112 h dug hole, 201 semiconductor chip, 202 semiconductor device,     212 a-212 h cutout, 301 semiconductor chip, 302 semiconductor     device, 312 a-312 d cutout, 401 semiconductor chip, 402     semiconductor device, 410 semiconductor substrate, 412, 412 a-412 f     recess, 414 semiconductor layer, 416 via hole, 501 semiconductor     chip,502 semiconductor device, 560 a-560 f conductor, 561 a main     portion, 562 a wide portion 

1. A semiconductor device, comprising: a support; a semiconductor chip provided on the support; and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein a plurality of cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor chip connected to the back surface, the die bond material is provided integrally over the plurality of cutouts, and each of the plurality of cutouts passes through the semiconductor chip from the back surface to an upper surface opposite to the back surface. 2.-7. (canceled)
 8. A semiconductor device, comprising: a support; a semiconductor chip provided on the support; and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein the semiconductor chip includes a transparent or semitransparent semiconductor substrate provided on the support, a plurality of recesses is formed in an outer peripheral portion of a back surface of the semiconductor substrate, the back surface facing to the support, and the die bond material is provided integrally over the plurality of recesses.
 9. The semiconductor device according to claim 8, wherein the die bond material enters each of the plurality of recesses.
 10. The semiconductor device according to claim 8, wherein at least one of the plurality of recesses is formed along each side of the back surface of the semiconductor substrate.
 11. The semiconductor device according to claim 8, wherein the plurality of recesses is formed at all edges of the back surface of the semiconductor substrate.
 12. A semiconductor device, comprising: a support; a semiconductor chip provided on the support; and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein the semiconductor chip includes a semiconductor substrate provided on the support, a plurality of recesses is formed in an outer peripheral portion of the semiconductor substrate, each of the recesses passing through the semiconductor substrate from a back surface facing to the support to an upper surface opposite to the back surface, the semiconductor chip includes a plurality of conductors each of which is embedded in a corresponding one of the plurality of recesses from the upper surface side of the semiconductor substrate, and the die bond material is provided integrally over the plurality of recesses.
 13. The semiconductor device according to claim 12, wherein each of the plurality of conductors contacts the die bond material.
 14. The semiconductor device according to claim 12, wherein each of the plurality of conductors is separated from an electrode of the semiconductor chip.
 15. (canceled)
 16. The semiconductor device according to claim 9, wherein at least one of the plurality of recesses is formed along each side of the back surface of the semiconductor substrate.
 17. The semiconductor device according to claim 9, wherein the plurality of recesses is formed at all edges of the back surface of the semiconductor substrate.
 18. The semiconductor device according to claim 10, wherein the plurality of recesses is formed at all edges of the back surface of the semiconductor substrate.
 19. The semiconductor device according to claim 16, wherein the plurality of recesses is formed at all edges of the back surface of the semiconductor substrate.
 20. The semiconductor device according to claim 13, wherein each of the plurality of conductors is separated from an electrode of the semiconductor chip. 